DUBLIN–(BUSINESS WIRE)–The “3D TSV and 2.5D Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” report has been added to ResearchAndMarkets.com’s offering.
The 3D TSV and 2.5D Market is expected to register a CAGR of 35.3% over the forecast period from 2021 to 2026.
Companies Mentioned
Taiwan Semiconductor Manufacturing Company Limited
Samsung Electronics Co. Ltd
Toshiba Corp.
Pure Storage Inc.
ASE Group
Amkor Technology, Inc.
United Microelectronics Corp.
STMicroelectronics NV
Broadcom Ltd
Intel Corporation
Jiangsu Changing Electronics Technology Co. Ltd
Key Market Trends
Consumer Electronics is Expected to Hold Significant Share
Consumer electronics is one of the most significant segments and is expected to grow at a considerable pace due to the rising number of smartphones, tablets, and other hand-held devices. According to Jefferies and Company, global smartphone shipments are bound to reach 2.45 billion units by the end of 2020. Due to advancements in technology in major sectors, the size of products, such as gaming devices and wireless handsets, encourages manufacturers to produce miniature-sized products, thereby, contributing to the market growth. The evolution of touch screens and other advanced features stacked behind the display, such as in-display fingerprint sensors and pressure sensors, are vital elements to differentiate consumer electronics in the market that attract new buyers.
Samsung introduced its Galaxy Watch, a smartwatch with a Bluetooth or standalone LTE model. Moreover, Huami Corporation, a biometric and activity data-driven company with significant expertise in smart wearable technology, also launched the Amazfit Verge and the Amazfit smartwatch. According to Consumer Technology Association, smartwatch unit sales reached 141 million (unit sales) in 2018, from 75 million in 2017, which is expected to contribute in 3D TSV demand. The demand for IoT-based consumer electronics may continue to gain traction, especially in Europe. This growth can be attributed to the growing trend of miniaturization and the ongoing need for connectivity.
Asia-Pacific to Witness the Fastest Growth Rate Over the Forecast Period
Asia-Pacific is the fastest-growing region for the market studied. The increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world. This is due to the rising population growth and urbanization. As per the GSM Association, more than four out of five connections may be smartphones by 2025. This trend is expected to increase the TSV technology usage for smartphones in this region. Industry 4.0 is also acting as one of the most emerging trends in Asia-Pacific. IoT devices and their miniaturization are an essential trend in Industry 4.0, utilizing 3D TSV. The region is investing heavily in IoT to support smart city infrastructure.
In September 2019, the GSMA APAC IoT partnership program expanded to include more than 30 mobile operators, making it the most significant IoT community in the Asia-Pacific region. In February 2019, Chunghwa Telecom selected Ericsson IoT Accelerator to drive IoT toward enterprise customers. Such instances are expected to open the door for 3D TSV vendors. Another critical factor is the growth potential for autonomous vehicles in this region, especially in key markets like China, Singapore, Japan, and India. In June 2019, Toyota announced to invest USD 2 billion to develop electric vehicles in Indonesia over the next four years, starting with hybrid cars. In January 2018, Ford spent USD 11 billion in electric vehicles, much higher than its previous USD 4.5 billion targets.
Key Topics Covered:
1 INTRODUCTION
1.1 Study Assumptions and Market Definitions
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET INSIGHTS
4.1 Market Overview (Covers the impact due to COVID-19)
4.2 Industry Attractiveness – Porter’s Five Force Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Consumers
4.2.3 Threat of New Entrants
4.2.4 Threat of Substitute Products
4.2.5 Intensity of Competitive Rivalry
4.3 Industry Value Chain Analysis
5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Expanding Market for High Performance Computing Application
5.1.2 Expanding Scope of Data Centers and Memory Devices
5.2 Market Challenges
5.2.1 High Unit Cost of IC Packages
6 TECHNOLOGICAL SNAPSHOT
7 MARKET SEGMENTATION
7.1 By Packaging Type
7.2 By End-user Application
7.3 Geography
7.3.1 North America
7.3.2 Europe
7.3.3 Asia Pacific
7.3.4 Rest of the World
8 COMPETITIVE LANDSCAPE
8.1 Company Profiles
8.1.1 Taiwan Semiconductor Manufacturing Company Limited
8.1.2 Samsung Electronics Co. Ltd
8.1.3 Toshiba Corp.
8.1.4 Pure Storage Inc.
8.1.5 ASE Group
8.1.6 Amkor Technology, Inc.
8.1.7 United Microelectronics Corp.
8.1.8 STMicroelectronics NV
8.1.9 Broadcom Ltd
8.1.10 Intel Corporation
8.1.11 Jiangsu Changing Electronics Technology Co. Ltd
9 INVESTMENT ANALYSIS
10 FUTURE OF THE MARKET
For more information about this report visit https://www.researchandmarkets.com/r/30r7do