DUBLIN–(BUSINESS WIRE)–The “Global Thin Wafer Market by Wafer Size (125 mm, 200 mm, 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic), and Geography – Forecast to 2027” report has been added to ResearchAndMarkets.com’s offering.
The global thin wafer market is projected to grow from USD 11.4 billion in 2022 and is projected to reach USD 20.6 billion by 2027; it is expected to grow at a CAGR of 12.5% from 2022 to 2027.
Reducing sizes of electronic devices, rising adoption of MEMS technology in portable health monitoring devices, growing smartphone and consumer electronics markets and high amount of material saving is expected to fuel the growth of the thin wafer market. However, issues related to efficiency maintenance is limiting the growth of the thin wafer market.
Market for 200 mm wafers to hold a significant share during the forecast period
200 mm wafers are expected to witness significant demand majorly on account of their wide adoption in power devices, ICs, LEDs, MEMS, and many other semiconductor and electronic devices. The 200 mm wafers are affordable and can be easily integrated into various devices. As a result, these wafers are adopted on a large-scale basis by small-scale and large-scale electronic manufacturers. Furthermore, for the manufacturing of devices that require small die sizes and have a global shipment size in the thousands, these wafers are increasingly being used. LED, RF device, and power transistors manufacturers use 200 mm silicon wafers.
In May 2022, Soitec (France) has released its first 200mm silicon carbide SmartSiCT wafer. With the release, Soitec is able to enlarge its SiC product portfolio beyond 150mm, take the development of its SmartSiCT wafers to the next level and cater to the growing demand of the automotive market.
Wafer polishing equipment market is expected to grow at the highest CAGR during the forecast period
The growth of the wafer polishing equipment market can be attributed to the increasing demand for thinner wafers to integrate microelectronics into various consumer electronic devices. The wafer polishing process creates thinner wafers compared to back-grinding alone and evens out any irregular topography and prevents warping that causes the wafers to weaken. Thus, there is an increased demand for wafer polishing equipment.
Moreover, the increasing number of semiconductor fabrication plants in countries such as China and Taiwan, owing to growing investments in semiconductor manufacturing, is expected to contribute toward the growth of the wafer thinning equipment market.
Asia-Pacific to hold the largest share of the thin wafer market during the forecast period
Asia-Pacific is expected to hold the largest share of the thin wafer market during the forecast period. The Asia-Pacific has witnessed large-scale adoption of smart electronic devices. This has led the consumer electronics manufacturers to launch higher-end devices in this region.
The acceptance of the latest technology trends by majority of consumer electronics manufacturers have stimulated the demand for thinner wafers in Asia-Pacific. In recent years, there has been a remarkable increase in the number of semiconductor fabrication plants and IC manufacturing firms in countries such as China and Taiwan, due to investments in semiconductor manufacturing this has paved way towards the growth of the thin wafer market in the Asia-Pacific region.
Market Dynamics
Drivers
Rising Adoption of MEMS Technology in Portable Health Monitoring Devices
Reducing Size of Electronic Devices
Growing Smartphone and Consumer Electronics Markets
High Amount of Material Saving
Restraints
Efficiency Maintenance – Major Issue for Thin Wafers
Opportunities
Expanding IC Industry in China
Growing Adoption of IoT and AI in Automotive Sector
Rising Adoption of Portable Devices
Challenges
Volatility and Susceptibility to Damage Caused by Pressure or Stress
Companies Mentioned
3M
Applied Materials
Atecom Technology Co. Ltd.
Brewer Science
Cree
Disco Corporation
EV Group
GlobalFoundries
GlobalWafers Co. Ltd.
Infineon Technologies
LDK Solar
Mechatronic Systemtechnik
Okmetic
PV Crystalox Solar PLC
Shanghai Simgui Technology Co. Ltd.
Shin-Etsu Chemical Co. Ltd.
Silicon Valley Microelectronics
Silterra Malaysia
Siltronic
Sil’Tronix Silicon Technologies
SK Siltron
Soitec
STMicroelectronics
Sumco Corporation
SUSS Microtec
Synova
UMC
UniversityWafer, Inc.
Virginia Semiconductor Inc.
VTT
Wafer Works Corporation
Wafer World Inc.
For more information about this report visit https://www.researchandmarkets.com/r/u8ntlg