VANTAA, Finland–(BUSINESS WIRE)–Okmetic, the leading supplier of advanced silicon wafers for the manufacture of microelectromechanical systems and sensors, today announced the release of UF-RFSi(R), a tailored silicon substrate dedicated for thin film surface acoustic wave (TF-SAW) hybrid structures. As the industry’s first wafer with ultra-flat properties, UF-RFSi leverages Okmetic’s proprietary A-MCz(R)-silicon material technology to deliver improved technical performance with high resistivity,